Pehea e hoʻomaʻemaʻe ai i ka busper copper flexbes ma diffusion undering mīkini mīkini?

Jul 23, 2025

Waiho i kahi memo

Weldingcopper flexible besbarsme ka hoʻohanaʻanaʻO ka mīkini wilikoi aku i ka kāohi ponoʻana o ka mahana, ke kaomiʻana, a me ka manawa e hōʻoia ai i ke kiʻekiʻe kiʻekiʻe, a me ka ikaika loa {{0}


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  • ʻO ka hoʻomaʻemaʻe papa:

Degrease me ka acetone a iʻole ka waiʻona {0}

E wehe i nā milila ma opeketio(e . G {{}}, 10% HSSO₄)ʻO ka hoʻomaʻemaʻe Plasma.

Loea: HoʻokōRa <0.2μmwili paakiki {0}

  • ʻOkiʻoki / shaping:

Shear a iʻole nā pahi kaua-ʻoki i ka nui o ka nui (e hōʻoia i nā kihi burr-free) {{}


2. mīkini hoʻonohonoho

Pākaukau Ka helu waiwai (Copper Buspis) Nā moʻolelo
Keka ao 400-600 pae Ma lalo o ka pihi Melting Melting (1,085 degree)
Ka paipai 20-50 mpa ʻOi aku ke kiʻekiʻe o ke kiʻekiʻe [{}
Wa 1-10 mau minuke Hilinaʻi i ka mānoanoa (e . g {{}, 1m vs {{} mm)
Hōʻailona Hakahaka (10⁻³ mbar) a iʻole H₂ / N₂ Gas Pale aku i ka oxidation

{{0} Ke kaʻina hana

  • ʻAkahi 1: Kāohi

Hoʻokomo pū i nā pahi kaua me nā'āpana overlapping (maʻamau ma luna2 × kahe pūʻana).

E hoʻohana ana i ka hoʻohanaʻana i nā kiʻi kiʻi cemic e pale aku ai i ka slippage {{}

  • KaʻAnuʻu 2: Heating & kaomi

ʻO Ramp-up phase: Wela i 300 papa ma5 TEX / MIN→ pili iā 5 mpa Pre-kaomi e hōʻoia i ka hoʻopiliʻana {{2}

ʻO ka papa'āina:

E hōʻea i ka Tart Temp (e {{0} G {{{}, 52}

E noi i ke kaomi piha (e {{} G {{{}, 30 MPA) → Pono no20-30 mins.

Key: ATOMSʻokoʻa ma waena o ka interface → grain palena pale vanish {{0}

  • Laki 3: E hōʻoluʻolu

Lohi ma3-5 degere / minMa lalo o ka hoʻemiʻana o ke kaomi (5 MPA) → Ke nānā nei i ke kauaʻana {1}


4.

  • Hōʻike hōʻoia: E ana i ka pale ma waena o nā mea i hui pūʻia< 1.1× base material resistance.
  • Hōʻailona hōʻikeʻike:

Ikaika ikaika: >80% of Cu's tensile strength (e.g., >210 MPA no C11000) {{2}

Hōʻike hōʻike flex: Ke ola 10, {{} Dosxars (no ka Flexibles Fanbars) {{}

  • ʻO ka loiloi Microstructure: SEM / EDS hōʻoiaKe ulu nui nei ka uluʻanaMa waena o ke kikowaena {0}

{{0

  • No nā pahi kaʻa kaʻa (0.1-1mm):
    • HoʻohanaPul(e . G {{{}}, 10 MPA → 30 mpa exform (30}
  • No ka hoʻokomo kiʻekiʻe:
    • Nā hui HaifeiNā Kūlana Nui-StackWELD 10-20 Busbars i kēlā me kēia flycle {{2}
  • Ke komoʻana i ka hui (CU-Al):
    • HoʻohuiNi Interlayer(0. 01Mul) → Blocks Bricks Cualution.

No ke aha maiʻO ka undering underingBeats i nā koho

Kūlana HE KUPAIU ʻO ka hoʻomaʻemaʻeʻana i ka maikaʻiʻana
Laser Welding Hāʻawiʻo Haz i ka hana ʻAʻole melol →ʻO 100%ʻO iaʻo ICS Conductivity
Mohaihala ʻO ka Clux Reserdies Corrode ma mua o ka manawa Flux-free, maemae maikai
Nāʻoka uila ʻO ke kākoʻo kiʻekiʻe ʻO ka paʻa metallirgical= i lalo

 

 


Ka hopena hope

A ʻO kaʻokoʻaʻana o nā mea hoʻokūkū CopbusWill:
✅ lawe{{0} IMSMe ka piʻiʻana o nā hotspots (vs {0} A no nā pūlima pili) {{}
✅ ke ola aiKaukuhi / ShockI nā mea kūʻai / robotics {0}
✅'Oluā{{0} 5 makahikiI nā noi / mana hana {0}

E ka hoʻopaʻaʻana i nā mea hoʻohālikelike, nā mea e hana ai i nā hanaʻO ka māmā, ikaika, aʻoi aku ka hilinaʻiʻO nā pahi ma mua o kahiʻano maʻamau {0} 🚀

E hoʻouna i ka noi
Kāhea iā mā˚ouInā he nīnau

Hiki iāʻoe ke leka uila iā mākou ma ke kelepona, leka uila a iʻole ka leka uila ma lalo iho o ke kiʻi ma lalo o ke kiʻiʻana iāʻoe ma hope koke

Kāhea aku i kēia manawa!